Support available from just one piece! A component-integrated board that reduces dead space and achieves miniaturization! Ideal for the miniaturization and integration of printed circuit boards!
Recently, in response to the miniaturization and high density of electronic devices, there is a demand for the miniaturization and integration of printed circuit boards. The technology of embedded substrate, which reduces the surface area for component mounting by embedding components within the circuit board and minimizing dead space, is being sought after. SIMPACT is accepting orders for prototypes of embedded substrates. Please feel free to inquire from just one piece. 【Features】 ■ Components can be mounted at low temperatures and in a short time ■ Reduced load on components due to a dry process that eliminates the need for drilling and copper plating after mounting ■ Technology that connects wiring between different layers at arbitrary positions, enabling the shortest possible wiring formation ■ Vertical embedding allows for the embedding of many chips *For details, please request materials or view the PDF data from the download.
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basic information
【Merits】 ○ Modularization leading to functional componentization ○ High-speed operation (short wiring) ○ Noise resistance (short wiring and shielding) ○ Miniaturization (three-dimensional mounting) ○ Heat dissipation ● For more details, please contact us or download the catalog.
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