Excellent heat dissipation and heat resistance! A substrate that can also be specified with high thermal conductivity type.
Aluminum substrates have excellent heat dissipation and heat resistance that far surpass the commonly used substrate materials FR-4 and CEM-3. Recently, there has been a significant increase in substrates equipped with high-power LEDs. At Fuji Print Industry, we can create single-sided substrates with a pattern formed by laminating an insulating layer and copper foil on an aluminum-based material, as well as double-sided substrates with a core of aluminum, where an insulating layer and copper foil are laminated to create through holes and form patterns. 【Features】 ○ Excellent heat dissipation ○ Excellent thermal conductivity For more details, please contact us or download the catalog.
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【Aluminum Core Board Manufacturing Process】 ○ Aluminum Core Drilling ○ Aluminum Core Filling ○ Lamination ○ Pressing ○ Drilling ○ Plating ● For more details, please contact us or download the catalog.
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![Component-integrated board SIMPACT [Reducing dead space for miniaturization!]](https://image.mono.ipros.com/public/product/image/3bb/2000229929/IPROS5081154782342606499.jpg?w=280&h=280)
