Supports upper and lower exchanges! POP implementation and rework are possible.
At K-All, we can handle POP implementation and rework. The PoP technology, which stands for "Package on Package," is a technique that allows for the stacking of ICs and components on top of an IC package. With the technology of POP implementation, BGA implementation with an interposer board is also possible. Compared to jumper wiring, QCD (Quality, Cost, Delivery) is improved. It enables low-cost evaluation and signal conversion for BGA. Through discussions between our customers and K-All's design team, we promise reliable QCD. 【Features】 ○ Capable of POP implementation and rework ○ If there are many correction points, we can propose POP implementation using an interposer board ○ We can consider and propose the merits and demerits of both jumper and interposer board options For more details, please contact us or download the catalog.
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【Case Studies】 [We want to modify the BGA jumper (48 pins, 50 units) at a low cost] ○ As a result of discussions among the customer, sales representative, BGA operator, design team, and quality control department, we proposed to implement the modification by creating a conversion board and using a combination of stacked mounting instead of the BGA jumper. [We purchased a large quantity of overseas IC packages, but we cannot accurately determine their quality, so we want to create a simple checker] ○ As a result of discussions among the customer, designer, and BGA operator, we proposed to address this by creating a conversion board and performing modification work. ○ If standard sockets are manufactured by a socket manufacturer, it takes more than three months. → By using modified sockets and stacked mounting of conversion boards, we can produce and deliver in 0.5 months. * To strengthen the checker, we fixed and reinforced it with underfill after stacked mounting, enabling a large number of device checks. * Compared to modification methods using multiple jumper wiring for BGA, the combination of conversion boards and stacked mounting not only has less risk but is also more effective in terms of shorter delivery times and cost reduction. ● For more details, please contact us or download the catalog.
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Company information
Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.