Compact and space-saving tabletop diamond wire saw for laboratory use, easy-to-handle single wire type.
It is ideal for research and development purposes.
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basic information
Workpiece: Glass, crystal, silicon wafer, magnesium silicide, etc. Workpiece dimensions: 100×100mm Wire travel method: Reciprocal travel Wire speed: 10–100m/min Wire diameter: 0.12–0.26mm Workpiece feeding method: Weight pressure method Pressure: 20–500g, adjustable by changing weights Feeding stroke: 100mm Motor: 120W brushless motor Body size: 740(D)mm × 520(W)mm × 500(H)mm Weight: 28kg Input power: AC100V 10A Options: Circulating coolant system
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Ideal for research and development purposes.
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Company information
July 2009: Received certification for a research and development plan related to the advancement of manufacturing infrastructure technology for small and medium-sized enterprises from the Ministry of Economy, Trade and Industry. June 2010: Began joint development with the National Institute of Advanced Industrial Science and Technology on glass etching for solar cells. February 2011: Ordered and received an 8-inch chemical cleaning system for the 3D semiconductor research center. July 2011: Contracted by Saitama Prefecture for the next-generation industry entry support project. November 2011: Developed an alkaline spin etching system. Specifications: For large substrates (300 mm square). February 2012: Completion of the next-generation industry entry support project in Saitama Prefecture. April 2012: Newly developed silicon wafer separator for solar cells.