Transfer the chips placed on the tray to the specified separate tray.
This is a device that transfers chips placed on a tray to a designated separate tray based on the tray information (information for each chip) stored in a pre-saved CSV file. It can accommodate up to 8 classifications. It contributes to the rationalization of chip transfer operations.
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basic information
- Chips are transferred using a vacuum suction type P/P (Pick & Place) head. The chip data before and after the transfer is saved on the attached PC. - Equipped with two cameras, it performs alignment checks of the chip holding state and verifies the storage state in the tray. - It is equipped with a code reader to read the tray ID. Additionally, the order of chip storage in the tray can be set.
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Applications/Examples of results
We are receiving orders from various industries.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
