Work length measurement and foreign object inspection
Using an image processing system, we will perform length measurement and foreign object inspection of the workpiece. The workpieces will be sorted based on the pass/fail judgment results from the image processing system.
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basic information
- The equipment capacity is 1.8 seconds per workpiece. - Image processing resolution: 0.004mm. - Minimum detectable foreign object: 0.15mm. - The workpieces and inspection items will be determined through consultation. * The image processing resolution and minimum detectable foreign object may vary depending on the camera used and the camera's field of view.
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Applications/Examples of results
We have received orders from the medical industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.