From the smallest things in the world to those used in space! Simulation analysis based on experience and achievements.
WADOW Corporation offers simulation contracting services that leverage 30 years of experience in simulation technology. By selecting appropriate tools and analysis content, we can provide affordable and simple simulations tailored to your budget, as well as advanced detailed simulations based on your needs. We have simulated everything from items that have become thinner to those that have become transparent. We can assist in improving quality, reducing costs, and shortening development periods by supporting the latest interfaces. 【Features】 - High-speed serial transmission analysis - Capable of analyzing rigid-flex and multiple circuit boards - Miniaturization of circuit boards - Speed enhancement For more details, please contact us or download the catalog.
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basic information
【Lineup】 ○ SI Simulation → Signal waveforms, signal timing, eye diagrams, etc. → Tools used: ALLEGRO, Lightning, HyperLynx, ADS, etc. ○ PI Simulation → Input impedance, transfer impedance, etc. → Tools used: PIStream, SIwave, Ansoft Designer, etc. ○ EMI Simulation → Plane resonance, electromagnetic radiation, EMI rule check, etc. → Tools used: DEMITAS NX, EMI Advisor, HyperLynx, ALLEGRO, etc. ○ Electromagnetic Field Simulation → S-parameter extraction, current distribution, IR drop, etc. → Tools used: HFSS, SIwave, etc. ○ Thermal Simulation → Board temperature distribution → Tools used: ANSYS ● For more details, please contact us or download the catalog.
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WADOW Corporation has been dedicated to the industry for over 30 years. During the dawn of simulation software, we participated in technology development in the United States and introduced it not only in Japan but also around the world. From the world's first and smallest products to those used in space and even transparent ones, we have utilized various software and simulation methods (such as SI, PI, EML, thermal, etc.) totaling in the thousands. Let's work together to try miniaturization, speed enhancement, and reduction of layers in circuit boards.