Simultaneously achieve surface cleaning and primer treatment! Reduces labor hours.
The "SSP Series" was developed for processing when it is physically difficult to polish inner layers or flexible substrates with machines during the pre-lamination process, and when there is a desire to minimize chemical etching. It is now possible to completely remove chromium, which was previously considered difficult with conventional processing, using a single solution. 【Features】 ■ Removes impurities without significantly etching the copper surface ■ Simultaneously removes oxides, oils, and rust inhibitors ■ Improves resolution by allowing for a smooth treatment of the copper surface ■ Provides sufficient adhesion to the resist due to the primer film ■ Offers simple rust prevention until the next process due to the primer film *For more details, please refer to the PDF materials or feel free to contact us.
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**Mechanism of SSP Processing** In SSP processing, while the substrate is immersed in the solution, unwanted substances such as chrome coatings, fingerprints, grease, and oxides that hinder adhesion are removed. Additionally, a passivation treatment is applied to make it difficult for these substances to reattach. Furthermore, the cleaned metal surface is protected by this film, which helps delay oxidation and acts as an adhesion promoter for dry films. *For more details, please refer to the PDF document or feel free to contact us.*
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【Applications】 ■ Dry film lamination pretreatment for inner layer materials ■ Pretreatment for flexible substrates ■ Pretreatment for flexible substrate coverlays ■ Other metal surface treatments *For more details, please refer to the PDF document or feel free to contact us.
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Yakoh never forgets to put thought into each task and to approach it with a broad perspective that does not confine itself to a single field. We transform the required products, technologies, and services into more advanced offerings, utilizing our networks both domestically and internationally to provide reliable solutions.
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