Reduce solder joint defects! Fluorine-based wetting agent for lead-free solder.
The lead-free solder wetting agent "Futagent" improves the wetting spreadability of solder by adding it to the flux (filler) component. By reducing solder joint defects, it contributes to improved yield. The recommended addition amount is 0.1 wt% (active ingredient) relative to the flux. It is fluorine-based and does not fall under PFOS or PFOA. The wetting properties of solder are good when using flux with added Futagent. 【Features】 ○ For lead-free solder ○ Added to the flux (filler) component ○ Reduces solder joint defects ○ Contributes to improved yield ○ Fluorine-based, not applicable to PFOS or PFOA For more details, please contact us or download the catalog.
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【Overview】 [Recommended Product Numbers] ○ Futa-Jent 300 (Cationic type) ○ FTX-218 (Nonionic type) [Recommended Addition Amount] ○ 0.1 wt% (active ingredient) relative to flux [Soldering Process (Example)] 1. Apply flux (add Futa-Jent) 2. Place lead-free solder and heat to melt 3. Natural cooling 4. Cleaning ● For more details, please contact us or download the catalog.
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In the fields of precision cleaning, precision polishing, and metal surface treatment, we provide services that meet the needs of the industry with the technical expertise we have cultivated since our founding. In recent years, the entire industrial sector has been seeking products and services that do not burden the global environment. Our company takes this expectation seriously and will continue to focus strongly on "environment & cleanliness" in our product development and technological innovation, making the impossible possible and contributing to the sustainable development of the industry.