A cleavage device optimal for SEM cross-section observation sample preparation and FIB pretreatment. It exposes the cross-section of the targeted area with high precision and accuracy.
The LatticeAx420 can perform micro-indentation (shallow cuts) to cleavage all in one machine, with an accuracy within ±10um (patent pending). In recent years, it has gained attention as a preprocessing tool for cross-sectional observation of TSVs and bumps, producing cross-sections suitable for SEM observation in just under 5 minutes, and is also used as a preprocessing tool that significantly reduces processing time for FIB and other methods. Since it does not perform scribing, there is no risk of losing the target area.
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【Features】 - Fast (within 5 minutes) - High precision (within ±10um) - High reproducibility not affected by the operator - Low cost - Maximum sample size: 8-inch wafer or 1/2-300mm wafer - Minimum sample size: 9mm *Sizes below this require a dedicated accessory kit - Ideal for cross-sectional analysis of TSVs and bumps - The cross-section after cleaving is exposed with a mirror finish
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Applications/Examples of results
- Semiconductor wafer, glass cleaving, dicing - Cross-sectional observation pre-treatment - FIB processing pre-treatment
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