Improved heat dissipation and miniaturization of substrates with 'copper embedded (copper inlay) substrates'

Added to bookmarks
Bookmarks list

Bookmark has been removed
Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.
Free membership registration

last updated：Jan 11, 2019

名東電産

Official site

Achieves high heat dissipation! A lightweight substrate with a highly thermally conductive copper plate embedded beneath the heat dissipation component.

"Implanted copper substrates" are boards that embed high thermal conductivity copper plates (398W/mk) beneath heat dissipation components. By locally embedding copper plates in areas that need heat dissipation, they are more cost-effective and lighter than copper core substrates. 【Reasons to Choose This Product】 - Compatible with any base material! - Cost-effective heat dissipation compared to increasing copper thickness! - Takes up less space compared to using heat sinks, enabling miniaturization! - The size of the embedded copper can start from 2.0mm in width (negotiable). For more details, please contact us or download the catalog.

Related Link - http://www.meito-densan.co.jp/

Inquire About This Product

basic information

[Meito Electric Industry Co., Ltd. Product Information] ○ Printed Circuit Board Manufacturing → Automotive Boards → High-Frequency Boards → High Thermal Conductivity and High Current Boards → Hybrid Material Composite Multilayer Boards → Industrial Equipment Boards ○ Electrical Insulation Material Processing ○ Metal Material Processing ○ Mold Manufacturing ○ LED Related ● For more details, please contact us or download the catalog.