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  5. Printed Circuit Board
  6. Printed circuit board "Side plating / Dissimilar material bonding / Cavity substrate"

Printed circuit board "Side plating / Dissimilar material bonding / Cavity substrate"

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last updated:Jan 22, 2018

名東電産
名東電産
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Achieve shield effect! Side plating substrate capable of forming half-through holes on the side parts.

At Meito Electric Co., Ltd., we manufacture and sell printed circuit boards such as "side-plated substrates," "dissimilar material laminated substrates," and "cavity substrates." The "side-plated substrate" achieves a shielding effect by applying plating treatment to the outer edge surface of the substrate. The "dissimilar material laminated substrate" allows for combinations tailored to your needs, such as laminating high-frequency materials with epoxy resin. The "cavity substrate" can be produced more easily than structures that embed electronic components into the substrate. 【Features】 ○ Side-plated substrate: → Half through-holes can be formed on the side surface → Plating can also be formed around the entire circumference of the substrate's side surface ○ Dissimilar material laminated substrate: → Various sizes are available to accommodate small quantities of diverse multilayer workpieces → Supports surface treatments such as heat-resistant flux, lead-free solder leveling, and gold plating ○ Cavity substrate: → Enables low-profile modules *For more details, please refer to the PDF document or contact us directly.

    Printed Circuit BoardCircuit board design and manufacturing
異種材画像_名東電産.JPG

Printed circuit board "Side plating / Dissimilar material bonding / Cavity substrate"

異種材画像_名東電産.JPG
異種材画像_名東電産.JPG
  • Related Link - http://www.meito-densan.co.jp/

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basic information

【Examples of Hybrid Material Laminates】 ○FR-4: RO Material ○FR-4: PPE Material ○PPE Material: Teflon Material ○RO Material: Teflon Material *RO Material is a composite substrate of thermosetting resin with ceramic filler and glass cloth. *For more details, please refer to the PDF document or contact us directly.

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【Side Plated Board Applications】 ○ The board can be directly soldered to the housing, etc., which is useful for applications such as GND reinforcement. ● For more details, please contact us or download the catalog.

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名東電産

名東電産

Manufacturing and processing contract

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Products created from Meito Electric's technology, which seeks higher precision, contribute to safety and comfort. If you have any questions about printed circuit boards or electrical insulation materials, please feel free to consult us.

Product/Service List (23)

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