[JIS Standard] Resin Hardening Shrinkage Stress Measurement Device "CUSTRON"

Real-time continuous measurement of resin shrinkage rate and stress is possible. Contributes to reducing man-hours and effort in research and development! Free sample measurement limited to one time per company!

The resin curing shrinkage stress measurement device "CUSTRON" is capable of continuously measuring the curing shrinkage rate and shrinkage stress associated with the curing of UV-curable resins, thermosetting resins, epoxy resins, UV adhesives, UV inks, coatings, waxes, and more. The thermal profiles of heating and cooling, such as UV irradiation, heating, and cooling, can be freely combined and set through programming. It reproduces the shrinkage rates and shrinkage stresses that products experience when subjected to various heats during the manufacturing process or placed in different environments over a long period. ~Key Points!~ 1. Stress and shrinkage rate can be measured with a single device. 2. Continuous real-time data acquisition is possible even during the resin processing stage. 3. Widely adopted by major automotive manufacturers and chemical companies. 4. For those who wish to measure but do not have the device, a paid contract measurement service is also available. 【Features】 ○ Continuous measurement of the entire process before, during, and after the reaction. ○ Heat cycle measurement. ○ Reproduction of environmental conditions. ○ A sample size of only 1cc is sufficient. 【A type with temperature settings from -100 to 400℃ will be released soon!】 *Free sample measurements can be conducted either by visiting our office or by mailing samples. Data will be output in Excel format, with a maximum duration of 3 hours.

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