High hardness variable film thickness! ta-C thin films using nano film FCVA technology.
Nano Film Technologies Japan's FCVA technology can produce ta-C (tetrahedral amorphous carbon) films (a level above DLC) with excellent uniformity and quality. ta-C has an amorphous structure of sp3 and sp2 bonds and does not contain hydrogen. The ta-C thin films produced by Nano Film's FCVA technology contain approximately 40-85% sp3 bonds. 【Features】 - High hardness - Variable film thickness - Low surface energy, excellent adhesion, excellent non-adhesion - Low wear rate, low friction coefficient (high contact angle) - Easy peelability (via RIE process) For more details, please contact us or download the catalog.
Inquire About This Product
basic information
【Comparison of ta-C and DLC】 ［Properties: DLC / ta-C］ ○Diamond content: ~25% / ~85% ○Density: ~2g/cm³ / ~3.3g/cm³ ○Hardness: ~15GPa / ~50GPa ○Wear rate: ~8×10⁻⁸mm³/Nm / ~1.0×10⁻⁸mm³/Nm ○Frictional coefficient: ~0.14 / ~0.1 ○Critical load: ~250mN / ~1200mN ○Coating temperature: ~200℃ / <80℃ ○Working temperature (without O₂): ~600℃ / ~800℃ ○Typical thickness: ~2μm / ~1μm ○Coating vacuum: ~10⁻²Torr / ~10⁻⁵Torr ○Coating species (particle) energy: <5eV / ~70eV ●For more details, please contact us or download the catalog.
Price information
Please contact us.
Delivery Time
※Please contact us.
Applications/Examples of results
For more details, please contact us or download the catalog.
catalog（2）
Download All Catalogs
Company information
Our development technology has obtained international patents and plays a significant role in society. The super DLC (hydrogen-free ta-C film) produced by the FCVA method is formed through a completely different process compared to DLC films generated by existing PVD and CVD methods. Additionally, there is a composite metal film called "Micc film" that excels in release properties between metals and plastics. Coating films produced by the FCVA method are currently being rapidly adopted in fields such as the hard disk industry, precision machinery industry, and semiconductor industry, and future expansion into the automotive industry, nanoimprint industry, and biomaterials field is anticipated.
