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  6. Heat-resistant adhesive | Conductive and thermal conductive adhesive Alembond series

Heat-resistant adhesive | Conductive and thermal conductive adhesive Alembond series

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last updated:Mar 15, 2019

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A heat-resistant adhesive developed by Alemco Inc. (USA) that is based on silver particles and has excellent conductivity and thermal conductivity.

The "conductive heat-resistant adhesive" manufactured by Alemco is a product that mixes high-purity silver particles with a binder to provide heat resistance. It has very good conductivity and thermal conductivity, and in particular, it is significantly superior in electrical resistance compared to conductive adhesives based on standard epoxy resin.

    ChemicalsglueOther consumables
パイロダクト597.gif

Heat-resistant adhesive | Conductive and thermal conductive adhesive Alembond series

パイロダクト597.gif
パイロダクト597.gif
  • Related Link - https://www.audec.co.jp/products/bond/index.html#c…

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basic information

Aremco's new conductive heat-resistant adhesives - Pyroduct 597-A: Available in 25 grams or 50 grams - Aremco Bond 525: Available in 25 grams or 50 grams - Aremco Bond 556: Available in 50 grams - Aremco Bond 568: Available in 3 cartridges of 50ml, 1 pint (500ml), 1 quart (1L) - Aremco Bond 805: Available in 1 pint (500ml), 1 quart (1L) - Aremco Bond 860: Available in 1 pint (500ml), 1 quart (1L) - Aremco Bond 2315X: Available in 1 pint (500ml), 1 quart (1L)

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Applications/Examples of results

●Repair of printed circuit boards ●Sensors used in a vacuum ●High-temperature connectors and special light sources ●IC chips, semiconductor components, etc. ●Installation of thermal components

Detailed information

  • パイロダクト597.gif

    Piroduct 597-A Maximum heat resistance: 927℃ It contains silver as a filler with a resistivity of 0.0002 Ω·cm. Since it uses an inorganic binder, it has superior weather resistance and heat resistance compared to organic adhesives. Additionally, it does not emit off-gases, making it usable in a vacuum. It is a water-based, one-component silver paste.

  • アレムコボンド525.gif

    Alemcobond 525 Maximum heat resistance: 170°C It contains silver as a filler and has a resistivity of 0.01Ω·cm. It is a one-component epoxy system with excellent adhesion.

  • アレムコ556.gif

    Alemcobond 556 Heat resistance limit: 170°C It contains silver as a filler, and its resistivity is 0.0009Ω·cm. It is a two-component epoxy system that cures at room temperature.

  • 568.gif

    Alemcobond 568 Heat resistance limit: -65 to 204°C A highly thermally conductive two-component epoxy adhesive mixed with aluminum fine powder.

  • アレムコボンド805.gif

    Alemco Bond 805 Heat resistance limit: 300°C This is a high thermal conductivity epoxy adhesive that excels in adhesion and is used for bonding polyimide, plastic mixtures, glass, ceramics, and metals with high thermal expansion rates. After curing, it can also be subjected to machining processes such as drilling, tapping, and polishing.

  • アレムコボンド860.gif

    Aremco Bond 860 Maximum temperature resistance: 204°C This is a thermally conductive epoxy adhesive that excels in both thermal conductivity and insulation, and also has corrosion resistance. It is used for bonding heat sinks and fins in heat exchangers, as well as for assembling electronic components.

  • 2315X.gif

    Alemco Bond 2315X Maximum heat resistance: 185°C It has a low viscosity among thermally conductive epoxy adhesives, allowing it to be used for filling and coating. It also has good insulation and corrosion resistance, with low outgassing, meeting NASA standards. It is primarily used for bonding electrical and electronic components such as ICs, converters, oscillators, amplifiers, relays, transformers, and semiconductors.

Line up(7)

Model number overview
Pyraduct 597-A Water-based single-component silver paste.
Alemco Bond 525 Single-component epoxy with excellent adhesion.
Alemco Bond 556 Two-component epoxy that cures at room temperature.
Alemco Bond 568 High thermal conductivity two-component epoxy adhesive.
Alemco Bond 805 Used for bonding metals with high thermal expansion rates.
Alemco Bond 860 Excellent thermal conductivity and insulation, also resistant to corrosion.
Alemco Bond 2315X Low viscosity, can also be used for filling and coating.

catalog(8)

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Heat-resistant adhesive / Conductive heat-resistant adhesive "Piroduct 597-A"

Heat-resistant adhesive / Conductive heat-resistant adhesive "Piroduct 597-A"

PRODUCT
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Heat-resistant adhesive | Conductive heat-resistant organic adhesive "Aremco Bond 525"

Heat-resistant adhesive | Conductive heat-resistant organic adhesive "Aremco Bond 525"

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Heat-resistant adhesive | Conductive heat-resistant organic adhesive "Aremco Bond 556"

Heat-resistant adhesive | Conductive heat-resistant organic adhesive "Aremco Bond 556"

PRODUCT
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Heat-resistant adhesive | High thermal conductivity epoxy adhesive "Aremco Bond 568"

Heat-resistant adhesive | High thermal conductivity epoxy adhesive "Aremco Bond 568"

PRODUCT
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Heat-resistant adhesive | High thermal conductivity epoxy adhesive "Aremco Bond 805"

Heat-resistant adhesive | High thermal conductivity epoxy adhesive "Aremco Bond 805"

PRODUCT
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Heat-resistant adhesive | High thermal conductivity epoxy adhesive "Alemco Bond 860"

Heat-resistant adhesive | High thermal conductivity epoxy adhesive "Alemco Bond 860"

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Heat-resistant adhesive | High thermal conductivity epoxy adhesive "Aremco Bond 2315X"

Heat-resistant adhesive | High thermal conductivity epoxy adhesive "Aremco Bond 2315X"

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AODEC Inc. Company Profile

AODEC Inc. Company Profile

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Company information

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Chemical

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Audeck Co., Ltd. was established on June 28, 1973, with the aim of importing, manufacturing, and selling industrial chemical products. In November 1988, the company partnered with the American heat-resistant adhesive manufacturer, Alembic Products, to sell their ceramic and heat-resistant epoxy adhesives and ceramic coatings in Japan. In the late 1980s, the company began selling heated black dye, and after 1986, developed new heated black dyeing equipment. Furthermore, in 2003, they launched an electroless nickel plating device, continuing to grow steadily.

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