Used for temporarily holding parts that undergo dicing, grinding, or polishing processes.
This is a new type of temporary adhesive developed by AREMCO in the United States. It is used for temporary adhesion to backup blocks during dicing, grinding, and polishing processes. **Characteristics** It quickly and strongly adheres to ceramics, glass, and metals. **Examples of Applications** - Machining of the latest ceramics - Rough grinding and polishing of optical components - Metal piece processing for inspection under an electron microscope - Dicing of semiconductors - Dicing of ceramics and quartz materials
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basic information
- Crystal Bond 509: Thermoplastic temporary adhesive. Flow point is 74°C. - Crystal Bond 555: Low melting point thermoplastic temporary adhesive. Flow point is 48°C. - Crystal Bond 590: Thermoplastic temporary adhesive. Flow point is 150°C.
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Applications/Examples of results
- Metal piece processing inspected with an electron microscope - Dicing processing of semiconductors - Dicing processing of ceramics and quartz materials - Dicing of optical components and semiconductors - Rough polishing and finishing processing of optical components - Dicing processing of optical glass fibers and single crystal materials - Temporary adhesion to backup blocks during grinding and polishing work.
Detailed information
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Crystal Bond Series 509 is a new type of thermoplastic temporary adhesive developed by Alemco. ■ It is a caramel-colored stick with a diameter of approximately 22mm and a length of about 178mm. ■ Product details: The flow point is 74°C. It adheres strongly to metal, glass, and ceramics. Removal requires acetone or a dedicated removal solvent. ■ Capacity: Set of 5 sticks (weight 0.2 pounds (approximately 90g) × 5).
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Crystal Bond Series 555 A new type of low-melting-point thermoplastic temporary adhesive developed by Alemco. ■ Product Details: With a low flow point of 48°C, it can be easily adhered and removed with hot water. ■ White rod shape. ■ Capacity: Set of 10 sticks (weight 0.15 pounds (approximately 70g) × 10)
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Crystal Bond Series 590 A new type of thermoplastic temporary adhesive developed by Alemco. ■ Product Details: Melting point is 150°C. It has strong adhesion and elasticity. It is suitable for processing applications that involve heat or tall workpieces. ■ Brown rectangular rod shape. For removal, use isopropyl alcohol or a dedicated removal solvent. ■ Capacity: Set of 2 (Weight 0.5 pounds (approximately 225g) x 2)
Line up（3）
| Model number | overview |
|---|---|
| Crystal Bond 509 | ■Melting point is 74℃. Strongly adheres to metal, glass, and ceramics. ■Amber colored rod shape. ■Capacity: Set of 5 sticks (Weight 0.2 pounds (approximately 90g) × 5) |
| Crystal Bond 555 | ■Melting point is low at 48℃, making it easy to adhere and remove with hot water. ■White rectangular rod shape. ■Capacity: Set of 10 sticks (Weight 0.15 pounds (approximately 70g) × 10) |
| Crystal Bond 590 | ■Melting point is 150℃. ■Strong adhesion and elasticity. Suitable for processing work that requires heat or has height. ■Brown rectangular rod shape. ■Capacity: Set of 2 sticks (Weight 0.5 pounds (approximately 225g) × 2) |
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Company information
Audeck Co., Ltd. was established on June 28, 1973, with the aim of importing, manufacturing, and selling industrial chemical products. In November 1988, the company partnered with the American heat-resistant adhesive manufacturer, Alembic Products, to sell their ceramic and heat-resistant epoxy adhesives and ceramic coatings in Japan. In the late 1980s, the company began selling heated black dye, and after 1986, developed new heated black dyeing equipment. Furthermore, in 2003, they launched an electroless nickel plating device, continuing to grow steadily.