The U.S. SCI-made rotary magnetron cathodes have a delivery record of approximately 3,000 units worldwide.
Sputtering Components Inc., commonly known as SCI, was established in 2001 in Owatonna, Minnesota, USA. As of 2015, SCI's rotary magnetron cathodes have been delivered approximately 3,000 units worldwide. Their applications include various uses such as Low-E glass for construction, solar cells, electrode films for displays, and anti-reflective films, among others, at various customer sites. Our company, Sputtering Components Japan Co., Ltd., commonly known as SCJ, serves as the sales base in Japan for SCI products and the cylindrical and planar targets manufactured by our sister company, PMI.
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basic information
Manufacturer: Spattering Components Inc. (commonly known as SCI), USA Product: Rotary Magnetron Cathodes and Magnet Bars, along with related peripheral products Global Sales Record: Approximately 3,000 units Japan Handling Base: Spattering Components Japan Co., Ltd.
Price information
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Delivery Time
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Applications/Examples of results
Architecture: Sputter deposition of Low-E glass and anti-reflective films LCD: Sputter deposition of electrodes (transparent conductive films) and anti-reflective films Touch panels: Sputter deposition of electrodes (transparent conductive films) and anti-reflective films Solar cells: Sputter deposition of electrodes (transparent conductive films) and anti-reflective films Automobiles: Sputter deposition of side mirrors and rearview mirrors Decoration: Sputter deposition for coloring smartphones and wall materials
Detailed information
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SM Rotary Magnetron Mounting Method: Side Mount Model: SM (for large substrates) Compatible Target Length: Up to 4000 mm Maximum Input Power: 200 kW at DC / 80 kHz at MFAC Complete Cantilever: Up to 140 kg at 1500 mm Dedicated Motor and Dedicated Belt: Included Horizontal and Vertical Mounting: Both possible Magnet Angle: Freely adjustable 360 degrees
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MM Rotary Magnetron Mounting Method: Side Mount Model: MM (for medium-sized substrates) Compatible Target Length: Up to 2500 mm Maximum Input Power: 100 kW at DC / 80 kHz at MFAC Fully Cantilevered: Up to 140 kg at 1000 mm Dedicated Motor and Dedicated Belt: Included Horizontal and Vertical Mounting: Both Possible Magnet Angle: Freely Adjustable 360 Degrees
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CM Rotary Magnetron Mounting Method: Side Mount Model: CM (for small substrates) Compatible Target Length: Up to 1000 mm Maximum Input Power: 20 kW at DC / 80 kHz at MFAC Fully Cantilevered: Up to 45 kg at 750 mm Includes Dedicated Motor and Dedicated Belt Horizontal and Vertical Mounting: Both Possible Magnet Angle: Freely Adjustable 360 Degrees Special Notes: Capable of mounting targets with inner diameters of 80 mm and 125 mm
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SC Rotary Magnetron Mounting Method: Drop-in within a vacuum Model: SC (for large substrates) End Block Width: 204 mm Compatible Target Length: Up to 4000 mm Maximum Input Power: 200 kW at DC / 80 kHz at MFAC TTS Adjustment: Possible by inserting spacers Outboard Support Block: Included Dedicated Motor and Dedicated Belt: Included Horizontal and Vertical Mounting: Both possible Magnet Angle: Adjustable in 15-degree increments
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MCD Rotary Magnetron Mounting Method: Drop-in within a vacuum Model: MC-D (for medium-sized substrates) End Block Width: 160 mm Compatible Target Length: Up to 2500 mm Maximum Input Power: 100 kW at DC / 80 kHz at MFAC TTS Adjustment: Possible by inserting a spacer Outboard Support Block: Included Dedicated Motor and Dedicated Belt: Included Horizontal and Vertical Mounting: Both possible Magnet Angle: Freely adjustable up to 360 degrees
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TC Rotary Magnetron Mounting Method: Drop-in within a vacuum Model: TC (for small circuit boards) End Block Width: 58 mm Compatible Target Length: Up to 1500 mm Maximum Input Power: 40 kW at DC / 80 kHz at MFAC TTS Adjustment: Possible with spacers Outboard Support Block: Dual-holding type Dedicated Motor and Dedicated Belt: Included Horizontal and Vertical Mounting: Both possible Magnet Angle: Freely adjustable up to 360 degrees
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Swing Rotary Magnetron Model: Swing Cathode (for stationary substrates) Compatible target length: Up to 4000 mm Maximum input power: 200 kW at DC / 80 kHz at MFAC Includes dedicated motor and dedicated belt Horizontal and vertical mounting: Both possible Special notes: The internal magnet bar swings left and right. By arranging multiple units in parallel, it simultaneously achieves a distribution of less than ±1% and an efficiency of over 70% for stationary substrates.
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QRM Magnet Bar Model: QRM Bar (Strong Magnetic Field) Structure: 4-Row Magnetic Force: 1,056 Gauss at Outer Diameter 150 mm Magnetic Field Adjustment Screw: +2 mm to -7 mm Screw Position: Approximately every 300 mm Adjacent Screw Allowable Height Difference: Maximum 2 mm Maximum Usable Target: Outer Diameter 180 mm Spatter Angle: ±21 degrees Nominal Distribution: ±2% or less Nominal Target Usage Efficiency: 85% or more
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RAM Magnet Bar Model: RAM Bar (Remote Control Bar) Magnetic Field Adjustment Screw Operating Range: 20 mm Adjustment Accuracy: ±50 µm Screw Position: Approximately every 300 mm Nominal Distribution: ±1% or less at 3 m wide substrate Special Note: Adjustments of each position are controlled via optical fiber from outside the chamber. This allows for the distance between the magnet and the target to be adjusted with an accuracy of ±50 µm. Control is possible during the sputtering process, enabling ultimate distribution adjustments.
Company information
This is the Japanese sales office of Sputtering Components Inc, commonly known as SCI, a leading company in rotary cathodes frequently used in sputtering devices. We also handle cylindrical sputtering targets and planar targets from SCI's sister company, Process Materials Inc, commonly known as PMI. We would be grateful if you could feel free to contact us.