We offer products with high resolution at a low cost!
This product is a simple UV nanoimprint device for experimental use, equipped with an automatic mode release function. UV irradiation is performed while pressing. The mold size ranges from 25mm to 40mm, and the UV intensity is 0.5mW/cm². Additionally, you can choose optional features such as HP functionality and a degassing unit. We also have a wide lineup of other products available for selection based on different applications. 【Features】 ■ Equipped with automatic mode release function ■ High resolution at low cost ■ Pressing pressure of 10MPa *For more details, please refer to the catalog or feel free to contact us.
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【Specifications】 ■Mold size: 25–40mm ■Wafer size: 4 inches to 6 inches Si ■UV intensity: 0.5mW/cm² ■Options ・HP function ・Deaeration unit 【Product Lineup】 ■LTNIP-5000 ■LTNIP-7000 ■WEX-200 ■WMA-600 *For more details, please refer to the catalog or feel free to contact us.
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For more details, please refer to the catalog or feel free to contact us.
Company information
Riso Tech Japan, since its establishment, has been a specialist in lithography, providing not only resist exposure/development analysis equipment, resist coaters/developers, and lithography simulators, but also evaluation of exposure/development materials for cutting-edge lithography processes. In particular, for resist processing equipment, we propose optimal specifications tailored to customer needs, adapting spin coaters, developers, bake (PEB) equipment, and film thickness measurement to various fields, ranging from development experimental equipment to fully automated production systems. For example, we offer coating equipment for various substrates such as ultra-thin silicon wafers, various compound semiconductors, quartz, sapphire, and piezoelectric substrates (SAW), including ArF resist, EB resist, high-viscosity thick-film resist, polyimide, insulating films, and wax, as well as development equipment for alkaline, inorganic, and organic materials. Additionally, we provide various process units such as HMDS treatment, vacuum bake, UV irradiation, and high-temperature bake processing.