The pursuit is "high precision" and "processing that does not stress the material."
At Mikata Co., Ltd., we propose a resin cutting process that allows for stress-free extraction of resin films. When processing adhesive materials and wrapping them, there can be adhesive overflow from the side of the adhesive material (cut surface) as it approaches the paper tube (core) section. However, our company has successfully implemented a wrapping technique to prevent this overflow. With this stress-free method, we have achieved minimal adhesive overflow and a cross-section with almost no burrs during the cutting process. 【Features】 ■ Almost no adhesive overflow occurs during the cutting process with our stress-free method. ■ Achieves a cross-section with almost no burrs. *For more details, please contact us or download the catalog.
Inquire About This Product
basic information
【Overview】 When cutting out, glue overflow always occurred, but our company has devised a method to cut resin film without stress. *For more details, please refer to the catalog or feel free to contact us.*
Price range
Delivery Time
Applications/Examples of results
For more details, please contact us or download the catalog.
catalog（1）
Download All Catalogs
Company information
There are various types of double-sided tape processing. "What will you be attaching?" "What size do you need?" "Are you considering recycling?" "Is waterproofing necessary?" "Are there any thickness restrictions?" "Do you need heat resistance, durability, or light resistance?" Please feel free to consult us about anything.