A flexible circuit board that achieved over 10 million bending characteristics at 70℃! It is flexible and excels in bending performance even in high-temperature environments, ensuring high reliability!
The "High Flex FPC" is a flexible printed circuit board (FPC) with bending characteristics that exceed 10 million cycles at 70°C. By using a high Tg (glass transition temperature) coverlay, it suppresses the degradation of bending characteristics at high temperatures. It is flexible and excels in bending performance even in high-temperature environments, offering high reliability. 【Features】 ■ Significantly improved bending characteristics by using rolled copper foil ■ Capable of high-speed transmission of over Gbps with low loss ■ Easy to match characteristic impedance ・Characteristic impedance value can be matched at differential 100±15Ω *For more details, please request materials or view the PDF data from the download.
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【Performance】 《Evaluation Items (Standards)》 ■Contact Resistance: Below 20mV (Initial value below 50mΩ, resistance increase below 35mΩ from initial value) ■Dielectric Strength: 100V/1min (No discharge phenomena or traces) ■Temperature and Humidity Cycle (70℃/90%RH/2h to -20℃/2h): 1000h (Resistance change rate within 10%, insulation resistance above 500MΩ) ■Thermal Shock: -55℃/1h to +125℃/1h/100 cycles (Resistance change rate within 10%, insulation resistance above 500MΩ) ■High-Temperature Storage: 125℃/1000h (Resistance change rate within 10%, insulation resistance above 500MΩ) ■Low-Temperature Storage: -55℃/1000h (Resistance change rate within 10%, insulation resistance above 500MΩ) ■Moisture Resistance: +85℃/85%RH/1000h (Resistance change rate within 10%, insulation resistance above 500MΩ) ■Moisture Load: +85℃/85%RH/1000h/DC50V (Resistance change rate within 10%, insulation resistance above 500MΩ) ■Bend Resistance (Hinge Fold): 180 degrees/10 times (Load 1kg) (No disconnection) *For more details, please refer to the catalog or feel free to contact us.
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Company information
The Yamaiichi Electric Group is an organic collection of various technologies, ranging from semiconductor test IC sockets that achieve high reliability, connectors that influence performance as connections within devices and units, YFLEX (flexible printed circuit boards), to optical multilayer thin-film filters that affect the quality of optical devices. In the ever-evolving world of electronics, the Yamaiichi Electric Group provides the latest solutions at all times to remain your unwavering best partner and to pave the way for the future.