It features a compact design that can be placed on a desk!
The "PL101" is a laser IC decapsulation device that allows for the decapsulation of Cu wire ICs with minimal damage through laser and chemical opening. With the IR sensor, laser decapsulation can be performed with high reproducibility, and the Z-axis position is automatically adjusted to maintain the same focal distance throughout the process, in line with the progress of the laser decapsulation. Additionally, based on the extensive decapsulation know-how cultivated through sample processing and IC contract decapsulation services (ED lab), we provide the most suitable decapsulation conditions for the purpose of sample decapsulation. The processing time and chemical usage are significantly reduced by using laser decapsulation as a pretreatment. 【Features】 ■ Compact ■ Safe design ■ Easy operation ■ Time-saving ■ High reproducibility *For more details, please refer to the catalog or feel free to contact us.
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basic information
【Specifications】 ■External dimensions (mm): W440×D580×H600 ■Laser: Nd:YAG 1064nm ■Guide laser: 650nm <1mW class 2 ■Processing area: 50×50mm ■Stage ・Z-axis: Electric ・Movement range: 20mm ■Camera: Color ■Function: X-Ray image acquisition ■Power supply: AC100V 10A ■Weight: 50kg ■Standard external accessories ・Exhaust treatment device ・Computer *For more details, please refer to the catalog or feel free to contact us.
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For more details, please refer to the catalog or feel free to contact us.
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Company information
Japan Scientific Co., Ltd. is a company located in Itabashi-ku, Tokyo, primarily engaged in the development, manufacturing, and sales of semiconductor unpacking equipment and testing equipment, as well as providing contract unpacking services. Our equipment is widely used by customers around the world, and the unpacking technology developed through our contract unpacking service, EDLab, has gained high trust. For failure analysis, please leave it to Japan Scientific.
