We offer reliable and prompt IC unpacking services based on our extensive unpacking experience!
The "Contract IC Opening Service ED Lab" is a service provided by Japan Scientific Corporation that opens epoxy-based plastic molded IC packages using fuming nitric acid, fuming sulfuric acid, and concentrated sulfuric acid. We open the lead section, chip front, and partial openings according to your requests for size and location. Additionally, we perform open short checks for sea defects and measure diode characteristics. 【Features】 ■ Reliable and rapid IC opening ■ Uses fuming nitric acid, fuming sulfuric acid, and concentrated sulfuric acid ■ Opens according to requested size and location *For more details, please refer to the catalog or feel free to contact us.
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basic information
【Business Activities】 ■ Package opening work ■ Bare chip processing work ■ Surface passivation removal work ・ Aluminum wiring products ・ Copper wiring products ■ Wiring removal work ■ Lower layer passivation removal work ・ Aluminum wiring products ・ Copper wiring products ■ Photos ・ For confirming the opening condition ・ Optical microscope and magnifying glass JPG images ・ Electron microscope JPG images *For more details, please refer to the catalog or feel free to contact us.
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For more details, please refer to the catalog or feel free to contact us.
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Company information
Japan Scientific Co., Ltd. is a company located in Itabashi-ku, Tokyo, primarily engaged in the development, manufacturing, and sales of semiconductor unpacking equipment and testing equipment, as well as providing contract unpacking services. Our equipment is widely used by customers around the world, and the unpacking technology developed through our contract unpacking service, EDLab, has gained high trust. For failure analysis, please leave it to Japan Scientific.