The keynote speech will feature hot topics on the science of sports and presentations on fire simulation research.
CAE Utilization Technology Research Conference 2016 "Let's Talk About CAE in Kudanshita!" / "6th DADiSP Utilization Technology Research Conference" The CAE Utilization Technology Research Conference is celebrating its 6th year since the DADiSP Utilization Technology Research Conference. We have many user case studies planned. This event is packed with useful and up-to-date information on cloud CAE, composite materials, optimization, and more, which you won't hear elsewhere. ============================= ● Date and Time: August 5, 2016 (Friday) 10:00 AM - 5:30 PM (Networking event from 5:30 PM) ● Capacity: 80 participants ● Venue: Hotel Grand Palace 1-1-1 Iidabashi, Chiyoda-ku, Tokyo (• 1-minute walk from Kudanshita Station on the Tokyo Metro Tozai Line, Exit 7 (Fujimi Exit)) ● Registration: http://www.cae-sc.com/events/cae-conf-2016.html ■ Organized by: CAE Solutions Co., Ltd.
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<Agenda> A) Keynote Speeches 10:10 A-1 Case studies on the use of CAE in competitive sports 11:00 A-2 Research case studies utilizing fire simulation B) CAE foundational technologies supporting society 13:00 B-1 FEA assuming biological models in the field of orthodontics 13:50 B-2 Introduction of new features and case studies of DADiSP / Information from support 14:50 B-3 How to utilize DADiSP in equipment maintenance / Analysis of building vibrations using FDD method 15:40 B-4 Research on the characteristics and usage of Wavelet analysis / Introduction of the analog visual recorder VR-24 16:30 B-5 Diagnosis, monitoring, and prediction based on measurement data C) CAE foundational technologies supporting society 13:00 C-1 Nonlinear structural analysis of resin injection molded products using Autodesk Moldflow and Helius PFA / Topology optimization technology for weight reduction 13:50 C-2 Optimization of composite materials 14:50 C-3 Cloud HPC has come this far 15:40 C-4 Optimization case studies using the HELYX-Adjoint module 16:30 C-5 Why HELYX? Introduction of new features and case studies
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DADiSP, FDS, PyroSim, CFD, HELYX, OpenFOAM, Cloud CAE, composite materials, CFRP, optimization, weight reduction, SIMULIA, Abaqus, FEMAP, NASTRAN, fire, HyperSizer, Adjoint, vehicles, medical, orthodontics, implants, topology optimization, Autodesk, waveform analysis, signal processing, A/D conversion, D/A conversion, FFT, filters, automation, Tosca, Isight, fe-safe, experiments, analysis, simulation.
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Our company leverages the strength of having the largest CAE specialized call center in the country, striving to be more than just a solution vendor that sells packages. We provide a comprehensive CAE solution environment that offers consulting, implementation, initial training, and outsourcing, aiming to gain the support of our customers. Furthermore, regarding our products, we ensure a suitable offering that includes not only CAE software for designers but also high-end CAE tools such as NX Nastran, Abaqus, Moldflow, and OpenFOAM, as well as specialized analytical solutions in fields like acoustics, fire, and electromagnetics. To address the essential modeling issues in 3D CAE, we provide tools like SpaceClaim that allow for easy loading and modification of 3D models, thus establishing a product offering system that broadly covers CAE needs. We aim to further advance our support for the manufacturing industry and designers through CAE, aspiring to build a support system that contributes not just to solution provision but also to our customers' Quality of Life.