Diffusion bonding (thermal pressing) *Free comprehensive technical catalog available!

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last updated：Nov 11, 2020

ヤマテック

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Unlike welding, it is a processing technology suitable for manufacturing high-precision and finely sized parts without melting the base material!

Yamatec Co., Ltd.'s "Diffusion Bonding (Thermal Press Joining)" is a processing technology that utilizes the diffusion of atoms occurring between the bonding surfaces by closely adhering the base materials and applying pressure to the extent that plastic deformation occurs as little as possible under temperature conditions below the melting point of the base materials. Unlike welding, it joins without melting the base materials, making it suitable for the manufacturing of products that require high precision and small-sized components. Additionally, since it does not use adhesives, there are no issues such as gas generation or the need to clean excess parts. **Advantages of Diffusion Bonding** - Surface-to-surface bonding → No worries about peeling during post-processing (tapping, embossing, bending, etc.)! - Precision processing at the micron (μm) level is possible → Established technology for layering and bonding precision components created by photo-etching without misalignment or distortion! - Capable of accommodating various sizes and shapes, including miniaturization and precision → Enables bonding of up to 1000×1000mm! - Capable of manufacturing complex parts that could not be made before → Can create complex shapes and flow structures that are difficult to achieve with metal processing such as cutting! *For more details, please contact us or download the catalog (technical materials).*

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【Content】 ○ What is diffusion bonding (thermal pressing)? → Definition according to JIS standards → Differences from welding and adhesives → Compatibility with various metals → Dissimilar metals → Examples of applications using diffusion bonding ○ Diagram of diffusion bonding → Diffusion bonding using a vacuum hot press → The process of integration of the bonding interface as diffusion bonding progresses → Cross-sectional image of the interface after diffusion bonding of SUS430 ○ Advantages of Yamatec's diffusion bonding → Bonding of surfaces → Precision processing possible at the micron (μm) level → Capable of handling products from small-scale to large-scale → Manufacturing of complex structures that were previously impossible ○ Supported sizes → Max 1,000mm × 1,000mm → Minimum achievements Φ0.9mm, 2mm with cutouts (line width 0.1mm), etc. ○ Small lot support, etc. ● For more details, please contact us or download the catalog.