Equipped with two high-performance PPMU AD5522!
The "PCI-FEB" is a measurement board that consolidates the source, measure, IO, and communication control necessary for small-scale measurement systems into a CompactPCI 6U (8HP) format. It is ideal for measuring Ic, IGBT, FET, and bipolar transistors, as well as for open/short checks of assembled circuit boards, making it a product that achieves miniaturization and cost reduction of measurement systems. 【Features】 ■ Power control via RS-232C ■ Sampling possible with a single PCI-FEB ■ Multiple units can be used for parallel measurements *For more details, please contact us or download the catalog.
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basic information
【Specifications】 ■Standard: CompactPCI v.2.2, 32Bit 33MHz (local bus is 16Bit) 6U-8HP size ■PMU: Analog Devices Inc. PPMU AD5522 (16Bit 4ch PPMU) ×2 Voltage (FV) ±10V, Current (FI) ±5uA, ±20uA, ±200uA, ±2mA, ±10mA ■ADC: 16bit-1Msps & 256K Point Buffer ×2ch (simultaneous acquisition) Range switching via PGA (F.S. ±1.25V, ±2.5V, ±5V, ±10V) External differential input 4ch (multiplexer) ×2 PMU MI ±5uA, ±20uA, ±200uA, ±2mA, ±20mA, PMU MV ±10V Supports internal trigger and external trigger ■RS-232: 4ch isolated RS-232C I/F (D-SUB9) / isolation voltage withstand 3KVDC, etc. *For more details, please contact us or download the catalog.
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Applications/Examples of results
【Usage】 ■ Measurement of Ic, IGBT, FET, and bipolar transistors ■ Open and short check of assembled boards *For more details, please contact us or download the catalog.
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Company information
★ Both electrical design and mechanical design are supported, and the company continues to expand smoothly, with annual sales projected to increase from 9.7 billion yen last year to 12.5 billion yen this year (with the fiscal year ending this month). We have a total of 70 technical staff involved in various software designs such as measurement and control circuit design, image processing, mechatronics line design, and related peripheral designs, and the number of employees has exceeded 540. ★ Not only design but also sheet metal processing, machining, surface mounting, assembly, and inspection are in-house processes, ensuring short delivery times and high quality. In particular, we have equipment capable of handling large boards (500×600) and high-density boards (BGA, 0.5mm QFP) for circuit board assembly, and in the inspection process, we have equipment such as X-ray inspection machines and in-circuit testers. Additionally, we have renewed our equipment mainly at the Kumamoto, Hamamatsu, and Sagamihara factories. ★ In January 2015, we established the Sagamihara Division in addition to the Kyoto, Kumamoto, and Hamamatsu factories, creating a four-division structure, and in March 2016, new buildings began operations at the Kyoto and Kumamoto factories.
