Ideal for electroplating and electroless plating.
Copper oxide for plating (SS-CuO) is a powdered product used for replenishing copper ions in various copper plating solutions, making it ideal not only for electroplating but also for electroless plating. It is easy to work with and allows for very convenient management of the plating process. There is no increase in FREE Acid, enabling the maintenance of a stable plating bath. 【Features】 ■ High-purity functional copper oxide fine powder ■ Low residual chlorine content and excellent acid solubility ■ Achieves optimal effects for electro copper plating ■ Excellent powder flowability with an angle of repose below 35º For more details, please refer to the catalog or feel free to contact us.
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basic information
【Product Specifications (Item: Standards)】 ■CuO[%]: ≥97 ■Cu[%]: ≥77 ■Fe[%]: ≤0.005 ■Pb[%]: ≤0.001 ■Cl[%]: ≤0.002 ■Moisture[%]: ≤0.35 ■Yellow acid solubility [seconds]: ≤40 ■Dissolution state: A blue transparent liquid with no foreign substances *For more details, please refer to the catalog or feel free to contact us.
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Applications/Examples of results
【Usage】 ■ For printed circuit board manufacturing ■ Plastic plating ■ Supply of copper ions for copper sulfate plating and electroplating ■ High-purity raw material used in the production of various Cu salts *For more details, please refer to the catalog or feel free to contact us.
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Rat Corporation aims to be a company that satisfies its customers by leveraging its network with various electronic-related businesses both domestically and internationally to provide higher-level products and meet the diverse needs of its clients. For materials, equipment, manufacturing, and design of photomasks and printed circuit boards, trust Rat Corporation.