Presentation of materials: "Technical Documentation on Surface Treatment Thin Film Coating"

basic information

【Contents】 ■Wet plating and dry plating ■Vacuum deposition method ■Ion plating method ■Sputtering method ■Plasma CVD method ■Characteristics of various film formation methods ■Coating examples ■Patterned film formation, etc. 【Overview of Various Film Formation Methods】 ■Vacuum Deposition Method - A method that forms a film by evaporating (sublimating) the material to be made into a film in a vacuum, allowing the vapor to reach the substrate and deposit. ■Ion Plating Method - A method that forms a film by passing evaporated particles through plasma to give them a positive charge, applying a negative charge to the substrate to attract the evaporated particles and deposit them. ■Sputtering Method - A method that forms a film by colliding high-energy particles, generated by plasma, with the material, causing particles of the material to be ejected and deposited on the substrate. ■Plasma CVD Method - A method that forms a film by introducing a gas containing the elements to be made into a film, exciting or decomposing it with plasma, and allowing it to adsorb and react on the substrate surface. *For more details, please refer to the catalog or feel free to contact us.

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[Target Objects] A wide range including glass, ceramics, resin materials, metal materials, and Si wafers, capable of handling three-dimensional objects as well.