Wafer flatness measurement system!
The "FLA-200" is a non-contact flatness and thickness measurement system. It measures the flatness (TTV, BOW, WARP) and thickness of wafer samples. It supports measurements of thickness, TTV, BOW, warp, site flatness, and global flatness (in accordance with ASTM standards), and data output in CSV format is also possible. Additionally, it can be customized in various ways according to customer requests. 【Features】 ■ Software compatible with 2-D and 3-D mapping display ■ High-precision measurement using a 5mmφ core capacitive probe ■ High-speed measurement of 12,000 points in under 60 seconds *For more details, please contact us or download the catalog.
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【Measurement Specifications】 ■Measurement Targets ・Semiconductor and solar cell materials (silicon, polysilicon, SiC, etc.) ・Silicon-based epitaxial and ion-implanted samples ・Compound semiconductor-related (GaAs Epi, GaN Epi, InP, Ga, etc.) ■Measurement Size ・3 to 8 inches ■Measurement Range ・Thickness: 200 – 1200μm ・Bow: +/- 350μm ・Warp: 350μm *For more details, please contact us or download the catalog.
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For more details, please contact us or download the catalog.
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We respond to all needs related to resistivity/sheet resistance, providing high-precision and high-performance systems by leveraging the latest technology and extensive experience, from specification design to aftercare.