Problem Solving! Thermal Design of Electronic Components and Circuit Boards Using Infrared Thermography
Infrared thermography is useful for the "thermal design" of electronic components and small mounting boards!
Do you have any of these concerns regarding thermal design for electronic components and small mounting boards? <Three Common Concerns in Thermal Design> - Concern 1 Identifying short circuits or defective components on electronic boards, as well as issues caused by design or manufacturing errors, is quite cumbersome using testers or ammeters. - Concern 2 I want to measure the temperature of electronic components and understand the heat dissipation of small boards. However, they are too small to measure with thermocouples. - Concern 3 In practical tests for thermal simulations, various data is collected on multiple PCs, which makes data integration during analysis time-consuming. These concerns can be resolved with "infrared thermography." ↓ Please see the following basic information for the solution ↓
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Infrared thermography solves your concerns during the thermal design of electronic components and small printed circuit boards in the following ways: - If your concern is 1: Infrared thermography can visualize the temperature distribution across the entire board, allowing for quick identification of problem areas and estimation of causes from abnormal temperature patterns. - If your concern is 2: By combining infrared thermography with a close-up lens, you can magnify and observe small areas that are difficult to measure with thermocouples at a high resolution of 300,000 pixels. - If your concern is 3: All data measured with infrared thermography, data loggers, thermocouples, etc., can be simultaneously monitored and recorded on a single computer using integrated software. If you would like to know more about how infrared thermography can assist in thermal design, please contact us using the inquiry form below. Even if you are new to infrared thermography, feel free to reach out!
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Thermal evaluation of electronic components and small-sized mounted circuit boards.
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●Joining Equipment: We propose the most suitable methods and models for metal joining, resin welding, soldering, sealing, and more. This includes fiber laser welding machines, semiconductor laser welding machines, resistance welding machines (welding power sources, welding heads), pulse heat units (pulse heat power sources, reflow heads), resin thermal staking devices, ultrasonic welding machines, ultrasonic metal joining machines, ultrasonic cutters, ultrasonic food cutters, high-frequency induction heating devices, seam welding machines, welding monitors, pressure monitors, and system devices. ●Infrared Equipment: Infrared thermography is a device that detects infrared radiation energy emitted from an object and converts it into temperature, displaying the temperature distribution as an image. It is utilized in various applications ranging from research and development to quality control and equipment diagnostics. This includes infrared thermography, infrared modules, infrared thermography systems, and explosion-proof thermography cameras.