Leave the dicing, scribing, and appearance inspection to us!
Fujita Device Co., Ltd. is a company that operates as a member of the Fujita Group, engaging in backgrinding (BG), dicing, appearance inspection, design and manufacturing of printed circuit boards, and the development and production of labor-saving devices. We own equipment such as dicing machines, scribers, and metal microscopes for appearance inspection, and we are involved in a wide range of operations including the assembly and sorting of optical devices, jig packing, and the design and production of testing boards for semiconductors. With excellent technology and high quality provided by our outstanding staff, as well as cost performance, we offer superior products. By gaining high trust, we contribute to the development of our customers' businesses and society. 【Product and Service Introduction】 ■ Backgrinding (BG), dicing, and appearance inspection ■ Design and manufacturing of printed circuit boards ■ Development and production of labor-saving devices ■ Image inspection equipment ■ Package assembly *For more details, please download the catalog from the link below or feel free to contact us.
Inquire About This Product
basic information
【Main Equipment】 ■ Dicing M/C ■ Scriber ■ Metal Microscope for Appearance Inspection ■ Ultra-Pure Device ■ CAD System *For more details, please download the catalog from the link below or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the catalog or feel free to contact us.
Company information
Fujita Device Co., Ltd. is a company that, as a member of the Fujita Group, engages in back grinding (BG), dicing, appearance inspection, as well as the design and manufacturing of printed circuit boards, and the development and production of labor-saving devices. Additionally, if you send us samples, we will provide free image evaluation and propose image inspection equipment. Furthermore, we perform assembly of CAM PKG products and undertake a consistent process from die bonding, wire bonding, to encapsulation, so please feel free to contact us when you need our services.