From hole drilling to complex curves, highly flexible processing is possible. We will respond to our customers' requests 120%.
The SS400 series can be cut from t1.2 to t12, and the SUS series can be cut from t0.5 to t12. We can accommodate all sizes of plates from 3×6 to 5×10. *The plate thickness mentioned above is subject to consultation.
Inquire About This Product
basic information
We have introduced the latest laser processing machine from Mitsubishi Electric. Since we can perform all processes of cutting, bending, and welding in-house, we can respond quickly to our customers' requests. With processing using the latest equipment and skilled techniques, we will turn your requests into reality.
Price information
The price varies depending on the processing details and size. We will respond with a quote.
Delivery Time
※I will respond with a quotation.
Applications/Examples of results
We perform various processing tasks using laser cutting, including cutting thick and thin plates, drilling holes, and cutting out letters.
Company information
Sakino Seiki Co., Ltd. started as a foundry, was established as a machine shop, and is currently engaged in manufacturing equipment and metal processing. Approaching 90 years since its founding, we aim to be a company that carries on the technology and history of our predecessors while incorporating new technologies in line with the times. We believe in the technical skills of the Japanese people and our own technical capabilities, and we will continue to pursue new technologies in the future.
![[VA/VE Case] Reducing defects by clarifying processing areas through laser marking.](https://image.mono.ipros.com/public/product/image/2071035/IPROS2457213517112126668.jpg?w=280&h=280)
