High-precision curl bending processing. This is an example of 3D bending processing using a special metal structure.
【Examples of Processing Electronic Components Made of Copper Alloy (with Photos)】 - 3D Bending Processing Using Special Metal Structures Material: Copper Alloy Thickness: 0.08mm Application: Electronic Components In the precision parts business of Misuzu Industries, we utilize the technology of press processing (metal and non-metal) for ultra-small and thin parts developed through the manufacturing of watch components to perform intricate and complex shape cutting, bending, and drawing processes that were previously deemed impossible with conventional pressing. Our integrated manufacturing system, from mold design and production to press processing and surface treatment, enables us to achieve micron-level shape and precision orders from customers, meeting a wide range of needs. *For more details, please contact us directly.
Inquire About This Product
basic information
【Material】 Copper alloy 【Thickness】 0.08mm 【Usage】 Electronic components
Price range
Delivery Time
Applications/Examples of results
Electronic components
catalog（1）
Download All Catalogs
Company information
In the precision parts business, we have achieved the processing technology for ultra-small and thin parts through press processing (metal and non-metal) developed in the manufacturing of watch components, along with a consistent in-house manufacturing system that encompasses mold design and production, press processing, and surface treatment. This allows us to realize fine and complex shapes that were previously considered impossible with conventional pressing, including cutting, bending, and drawing techniques. We shape micron-order geometries and precision while responding to our customers' diverse needs. In the precision assembly business, we leverage our long-standing high-precision and high-density bare chip mounting technology, primarily focusing on reel-to-reel FPC mounting, enabling us to provide consistent support from dicing to final testing and sub-assembly.