High aspect ratio processing. Improved productivity through cutting to pressing! Punching with minimal leftover material relative to sheet thickness. For a sheet thickness of 2.0mm, there is a 20% leftover width.
[Case Study of Stainless Steel Medical Device Parts Processing (with Photos)] Punching process with minimal material left compared to plate thickness Plate thickness: 2.0mm, with 20% remaining width Material: Stainless steel Thickness: 2.0mm Application: Medical device parts In the precision parts division of Misuzu Industries, we leverage the technology of ultra-small and thin parts pressing (both metal and non-metal) developed through the manufacturing of watch components to perform fine and complex shapes that were previously impossible with conventional pressing, including punching, bending, and drawing processes. Our integrated manufacturing system, from mold design and production to pressing and surface treatment, allows us to meet customer requests for micron-level shapes and precision, addressing a variety of needs. *For more details, please contact us directly.*
Inquire About This Product
basic information
【Material】 Stainless steel 【Thickness】 2.0mm 【Usage】 Medical device parts
Price range
Delivery Time
Applications/Examples of results
Medical device parts
catalog（1）
Download All Catalogs
Company information
In the precision parts business, we have achieved the processing technology for ultra-small and thin parts through press processing (metal and non-metal) developed in the manufacturing of watch components, along with a consistent in-house manufacturing system that encompasses mold design and production, press processing, and surface treatment. This allows us to realize fine and complex shapes that were previously considered impossible with conventional pressing, including cutting, bending, and drawing techniques. We shape micron-order geometries and precision while responding to our customers' diverse needs. In the precision assembly business, we leverage our long-standing high-precision and high-density bare chip mounting technology, primarily focusing on reel-to-reel FPC mounting, enabling us to provide consistent support from dicing to final testing and sub-assembly.