MagiCarrier-β【Component Transport Fixture: High Heat Resistant Double-Sided Adhesive Sheet】
MagiCarrier-β
【Reusable】High Heat Resistant Double-Sided Adhesive Sheet - Widely used for temporary fixation of small parts and foreign object adhesion!
■ "MagiCarrier-β" is a double-sided adhesive sheet with high heat resistance. ■ By simply placing the product on the sheet, the adhesive resin on the surface of the sheet suppresses product shifting. ■ There are numerous adoption records for applications such as transporting thin substrates like FPCs during reflow processes and temporarily fixing small components. 【Features】 ○ Heat resistance: The heat resistance temperature of the adhesive resin is approximately 260℃ (based on internal reflow furnace verification results). ○ Reusable: It can be reused repeatedly even after being placed in the above high-temperature environment. ○ Selectable adhesive strength: The adhesive strength is available in four types: weak, medium, strong, and extra strong. ○ Processability: The sheet can be easily cut with scissors or a cutter. ○ Customization: In addition to the standard size of 240mm x 330mm, the sheet can be processed and delivered as a transport jig. ○ Cleaning: Even if dirt adheres to the adhesive resin surface and reduces adhesive strength, it can be restored through ethanol cleaning. *For details, please check the catalog or contact us.
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basic information
Regarding the layer composition (see product image 2), the "silicone adhesive resin (2)" on the adherend side can be selected from weak to super strong adhesion and has repeatability. The "silicone adhesive resin (4) (bonding surface)" on the base material side has a constant adhesion strength and does not have repeatability. *For more details, please refer to the materials. Feel free to contact us with any inquiries.
Price information
Please contact us.
Delivery Time
Applications/Examples of results
<<Examples of Use>> ■Transport in the assembly and manufacturing process of flexible (FPC) substrates ■Transport in the assembly and manufacturing process of thin substrates ■Transport in the manufacturing process of flat displays such as organic EL and touch panels ■Transport of thin films in the semiconductor manufacturing process ■Flip chip and BGA substrate assembly process ■Transport of small components such as capacitors *For more details, please contact us or download the PDF.
Detailed information
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Layer Structure This is an image of the adhesive sheet layer structure. "2. Silicone Adhesive Resin" allows you to choose from weak to super strong adhesive strength and has repeatability. "4. Silicone Adhesive Resin (Adhesive Surface)" has a constant adhesive strength and does not have repeatability.
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![IPROS3491141278687725125[1].jpg](https://image.mono.ipros.com/public/product/image_diagram/0db/444095/IPROS60367686253961943330.jpeg?w=140&h=140)
This is a configuration diagram for when a adhesive sheet is applied to the base material for use.
catalog（3）
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Company information
Kyosha Co., Ltd. provides one-stop solutions from PCB design to assembly. Our approach starting from board design allows for maximization of assembly efficiency and optimization of assembly conditions. We cater to both prototype development and mass production, so please feel free to consult us. Additionally, we support our customers' assembly needs with various assembly-related tools, including the highly acclaimed high-temperature adhesive carrier "MagiCarry" and flow soldering transport carriers.
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