PWB for CSP/module

Chip size packages for various components used in mobile phones and other small devices.

The "CSP/module PWB" is a chip size package that further miniaturizes standard BGA. Using our unique technology, we manufacture packages with a three-dimensional cavity structure. By adopting electroless gold plating, it eliminates the need for plated leads, allowing for high-density wiring. The sheet structure can accommodate various forms of assembly substrates, including dicing cut method, hanging method, and push-back method. 【Features】 ■ Selection of materials with high rigidity, low dielectric constant, high heat resistance, and halogen-free options ■ High-density wiring capability ■ Sheet structure allows for various forms of assembly substrates *For more details, please refer to the catalog or feel free to contact us.

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