Chip size packages for various components used in mobile phones and other small devices.
The "CSP/module PWB" is a chip size package that further miniaturizes standard BGA. Using our unique technology, we manufacture packages with a three-dimensional cavity structure. By adopting electroless gold plating, it eliminates the need for plated leads, allowing for high-density wiring. The sheet structure can accommodate various forms of assembly substrates, including dicing cut method, hanging method, and push-back method. 【Features】 ■ Selection of materials with high rigidity, low dielectric constant, high heat resistance, and halogen-free options ■ High-density wiring capability ■ Sheet structure allows for various forms of assembly substrates *For more details, please refer to the catalog or feel free to contact us.
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For more details, please refer to the catalog or feel free to contact us.
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【Usage】 ■ Mobile phones and other small devices *For more details, please refer to the catalog or feel free to contact us.
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Japan Micron focuses on the manufacturing of printed circuit boards and provides development and design assistance for various types of boards, including sensor boards and module boards, as well as some assembly. Utilizing patents, proprietary equipment, and unique technologies, we achieve diverse functionalities such as high density, miniaturization, heat dissipation, thinness, high-frequency characteristics, energy efficiency, and three-dimensionality, ensuring high reliability and producing products that meet our customers' needs.