Manufacturing high-brightness, high-heat-dissipation PWB for LEDs by combining high-precision processing technology with substrates and plating!
Our company manufactures high-brightness, high-heat-dissipation "PWB for LEDs" by combining high-precision processing technology with substrates, resist, plating, and more. We are capable of high-precision slit processing using routers, as well as slit processing with special presses and reflector-shaped hole processing. Additionally, by tenting one side of the through-hole with solder resist or copper foil, we prevent mold resin from flowing onto the backside during bulk molding after assembly. We create substrates with high heat dissipation structures by attaching thick copper foil or copper plates, or by processing copper plates using our high-precision machining technology. 【Features】 - Compatible with 0.1mm thick substrates and thin materials of 50 microns thickness - Gold plating, silver plating, and dual-color gold-silver plating available - Prevents mold resin overflow - Processes copper plates with high-precision cavity formation technology - High heat dissipation structure *For more details, please refer to our catalog or feel free to contact us.
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【Structure Examples】 ■Reflector Frame Adhesive Type ■Slit Type ■Reflector Hole Type ■Through Hole Tent *For more details, please refer to the catalog or feel free to contact us.
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【Usage】 ■LED, etc. *For more details, please refer to the catalog or feel free to contact us.
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Japan Micron focuses on the manufacturing of printed circuit boards and provides development and design assistance for various types of boards, including sensor boards and module boards, as well as some assembly. Utilizing patents, proprietary equipment, and unique technologies, we achieve diverse functionalities such as high density, miniaturization, heat dissipation, thinness, high-frequency characteristics, energy efficiency, and three-dimensionality, ensuring high reliability and producing products that meet our customers' needs.