Manufacturing high-heat-resistant substrates aimed at thermal conduction and heat dissipation of mounted components!
The "Metal Base Core PWB" is a substrate that combines a metal plate with good thermal conductivity to achieve the heat dissipation required when mounting LEDs and high-speed ICs. By laminating a resin substrate onto aluminum or copper plates, we manufacture high heat dissipation substrates with high-density wiring. By combining this with our unique cavity formation technology, we can achieve a more three-dimensional and high heat dissipation structure. 【Features】 ■ Base material is aluminum or copper plate ■ Copper foil laminated with insulating material that has excellent heat dissipation and voltage resistance ■ High heat-resistant substrate manufactured for the thermal conduction and dissipation of mounted components *For more details, please refer to the catalog or feel free to contact us.
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basic information
【Structural Example】 ■ High thermal dissipation copper substrate with a reflector-shaped cavity ■ MBGA with a metal heat sink attached to a double-sided board with window frame processing *For more details, please refer to the catalog or feel free to contact us.
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【Usage】 ■LED ■When equipped with high-speed IC, etc. *For more details, please refer to the catalog or feel free to contact us.
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Company information
Japan Micron focuses on the manufacturing of printed circuit boards and provides development and design assistance for various types of boards, including sensor boards and module boards, as well as some assembly. Utilizing patents, proprietary equipment, and unique technologies, we achieve diverse functionalities such as high density, miniaturization, heat dissipation, thinness, high-frequency characteristics, energy efficiency, and three-dimensionality, ensuring high reliability and producing products that meet our customers' needs.
