Advanced dam technology

A technology capable of forming high dams of approximately 0.1 to 0.6 mm through a unique special printing method.

Nippon Micron Co., Ltd. offers products with heat dissipation properties by applying heat spreaders using its unique metal sheet bonding technology. By bonding rigid substrates with sealing frames and rigid substrates with copper foil, it is possible to create package structures that are difficult to achieve with conventional multilayer designs. It is easy to form dams of varying heights and dimensions within the same product, and high dams of approximately 0.1 to 0.6 mm, which cannot be formed with conventional printing inks, can be created using our unique special printing method. Additionally, it eliminates gaps on the bonding surfaces that are likely to occur with adhesive-type sealing frames, allowing for batch processing unlike dispensers. 【Features】 ■ Gaps on bonding surfaces can be eliminated ■ Batch processing is possible ■ High dams can be formed using a special printing method ■ It is easy to form dams of varying heights and dimensions within the same product *For more details, please refer to the catalog or feel free to contact us.

Printed Circuit BoardOther electronic partsCircuit board design and manufacturing