A circuit board for packages that can accommodate multiple chip components!
The "Printed Circuit Board for Mobile Devices (Build-Up Specification Module Board)" is a product handled by Shinko Seisakusho Co., Ltd., which develops, designs, manufactures, and sells electronic circuit boards. This product features a build-up specification using laser vias, incorporating prepreg in the build-up layers to achieve rigidity, dimensional stability, and insulation reliability in thin boards. Additionally, filled vias allow for random placement of vias and via stack structures, enhancing design flexibility. The vias are filled with metallic copper, improving heat dissipation characteristics. 【Features】 ■ A board suitable for packages that can accommodate multiple chip components ■ Designed for mobile devices ■ Two types of conductivity options for laser vias (conformal vias and filled vias) ■ Improved heat dissipation characteristics due to copper filling in the vias *For more details, please refer to the catalog or feel free to contact us.
Inquire About This Product
basic information
【Specifications (Excerpt)】 [Double-sided / 4-layer build-up 1 stage / 6-layer build-up 2 stages] ■ Core thickness: 100 um / 40 um / 30 um ■ Prepreg thickness: - / 25 um / 30 um ■ Total substrate thickness: 140 um / 170 um / 250 um ■ Via diameter: φ80 um / φ60 um / φ60 um ■ Surface treatment ・Flux, electroless Au flash, electroless thick Au, electrolytic Au, electroless Ni Pd Au *For more details, please refer to the catalog or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Product Examples】 ■SAW Module ■Communication Module ■Camera Module ■GPS Module *For more details, please refer to the catalog or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Shinko Seisakusho Co., Ltd. operates as a company within the Sumitomo Metal Mining Group, primarily engaged in the development, design, manufacturing, and sales of electronic circuit boards. Our company conducts integrated production across all processes from design to prototype and mass production. Additionally, we not only focus on domestic production but also select overseas OEM partners according to our customers' needs for procurement and sales. If you have any inquiries regarding electronic circuit boards, please feel free to consult with us.
![[Published in Nikkei Sangyo Shimbun] Supporting the digital society with fine wiring technology.](https://image.mono.ipros.com/public/product/image/0f6/2000744307/IPROS99628200140249235669.png?w=280&h=280)
