Supports your desired groove width and shape! Cutting methods can also be set arbitrarily!
In groove cutting processing, we will process to your desired groove width and shape. Please specify the size such as pitch width and groove depth. In dicing processing, you can also set the cutting dimensions as needed, and we can accommodate bevel cuts and chamfering. For more details, please download the PDF or contact us.
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basic information
"Groove Cutting Processing" ◇ Processing Accuracy (V-Groove) Groove Width/Pitch Width: 0.1mm to ±5μm Groove Depth: 0.05mm to ±10μm *Varies depending on processing material and work size. Additionally, by selecting various types of blades, we can also accommodate U-grooves and square grooves. "Diamond Sawing Processing" ◇ Processing Accuracy Cutting Dimension: 0.3mm and above Cutting Tolerance: ±10μm Cutting Margin: 0.02mm and above *Varies depending on processing material and work size. Installed in a clean room with a class of 1000 or lower.
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Company information
Ceratec Japan is a specialized company in the processing of electronic materials and optical materials. In addition to our accumulated processing achievements and technologies, we utilize a variety of processing equipment to provide a consistent system from processing to quality assurance. We are continuously making efforts to respond to our customers' trust and ensure a safe and reliable transaction.
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