Supports a four-sided Ni barrier for solder suction prevention! Various combinations of processing are possible according to the product shape!
"Au plating" allows for full and partial plating on flat materials and pressed products, with hoop plating being possible. For Ni barrier processing of pressed products, both bent and stamped items can utilize "stripe plating," "spot plating," and "laser processing," all of which are compatible with 4-sided Ni barriers. [Features] ■ Full and partial plating on flat materials and pressed products can be accommodated with hoop plating. ■ Ni barrier processing for pressed products can utilize "stripe plating," "spot plating," and "laser processing." ■ Compatible with 4-sided Ni barriers. ■ By combining processing according to product shape, it is possible to reduce the amount of Au used. ■ Sealing treatment can provide lubrication to the surface of the coating. ■ Continuous hoop plating is possible. *If you would like a free sample, please include "Sample Request" in your inquiry. *For more details, please refer to the PDF document or feel free to contact us.
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【Processed Plating Patterns】 - Full Surface - Partial (Stripes, Spots) 【Processable Workpieces】 - Coil Material (Pre-plated Material) - Pressed Material (Post-plated Material) 【Processable Materials】 - Cu Alloys, SUS, 42ALLOY, Ni, etc. *For the processing specifications of "Partial Au Plating," please refer to the PDF document.
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For more details, please refer to the PDF document or feel free to contact us.
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"I want to increase conductivity," "I want to improve glossiness," "I want to make it rust-resistant," "I want to make it harder," "I want to improve slip resistance"... The functions and applications required for surface treatment technology are indeed diverse. For example, the "nickel barrier" for mobile phone connectors is one of the technologies we have established in response to our customers' requests. We sincerely address each of these customer needs and respond with the experience and know-how we have cultivated over many years. Additionally, we have pioneered lead-free plating technology that does not burden the environment. In our tin hoop plating line, we have integrated "reflow" inline, enabling a consistent production process from plating to reflow. Furthermore, to deliver our surface treatment technology to more customers, we are actively working on expanding our business locations. In addition to our two domestic locations (Toyama Factory (headquarters) and Tokyo Sales Office), we have also established a local subsidiary in Mexico, creating a system to deliver our surface treatment technology with high quality and speed. Takamatsu Plating is engaged in outstanding electroplating processing that adds various functions to a wide range of materials.