Direct plasma method using argon gas
This is a direct plasma device that uses inert argon as the carrier gas. By directly irradiating the plasma onto the substrate with stable glow discharge, powerful modification can be achieved. It excels in cost performance due to low power consumption and low gas usage. Since the generation of ozone and nitrogen oxides is extremely low, exhaust equipment is not required.
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basic information
Corresponding plasma width: Possible from 60mm to 2500mm Standard consumption (per 100mm head length) Carrier gas: Argon 3L/min Reaction gas: Oxygen 15mL/min Power consumption: 90w
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Applications/Examples of results
○ ACF crimping pre-process ○ Treatment before optical bonding ○ Surface modification for materials with poor wettability ○ Removal of photoresist residues from glass, wafers, etc.
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Company information
Ito Corporation has pursued a fundamental philosophy since its founding in 1946: "Doing the right thing for our customers, suppliers, and ourselves leads to success in all aspects." As a result, we have grown into a group company engaged in business activities in nine countries and 16 locations, fulfilling the headquarters function of the Ito Group. We are confident that "the ability to communicate with added value" is the greatest strength of the Ito Group. To achieve this, we provide our employees with opportunities to acquire advanced skills, build a network that covers the globe, and continue efforts to establish bases closer to our customers and suppliers for closer communication. The customers of the Ito Group range from small venture companies to large global corporations, but regardless of the size of the company, all our customers share the desire to improve productivity through the use of technology. Realizing this desire is where the Ito Group can demonstrate its capabilities, and we are convinced that the trust we build with our customers and suppliers as a result will lead to mutual further development.