We have resolved issues such as "resin chipping" and "chip cracks."
"AIGAMO" is a device equipped with a laser marking system that performs marking on lead frames and deburring and removal of resin parts. In recent years, it has been used to solve issues in the processing of miniaturized semiconductor products, such as "chipping of the resin that shapes the elements" and "rapid damage and wear of the mold's punch and die," and it is appreciated for the production of various semiconductor products. [Features] - Equipped with a laser irradiation device - Reduces the defect rate of semiconductor products - Reduces maintenance work on molds *For more details, please feel free to contact us.
Inquire About This Product
basic information
【Examples of Manufacturers with Laser Devices】 ■ Omron Laser Front Corporation ■ Keyence Corporation ■ Panasonic SUNX Co., Ltd. ■ Amada Miyachi Technos Co., Ltd. ■ Others *For more details, please feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Daiyon Densan Co., Ltd. is a company that designs and manufactures a wide range of equipment, from complex systems equipped with a series of processes such as semiconductor lead processing equipment, laser processing equipment, inspection, and loaders/unloaders, to standalone functional devices. Additionally, our equipment design responds to customer requests across various fields, including automotive parts assembly equipment and electronic components assembly. If you have inquiries such as "the equipment manufacturer turned me down" or "I need good ideas for labor-saving," please feel free to contact us.
![[Case Study of Laser Engraving Equipment] Direct Engraving on Large Parts](https://image.mono.ipros.com/public/default/object/noimage_l.gif?w=280&h=280)