Introducing a case study of quality improvement VE for precision press-processed products proposed to customers!
Our company manufactures precision stamped products for cutting-edge technology fields, including the semiconductor industry, automotive and in-vehicle applications, as well as electronic and electrical devices, and optical equipment. In these fields, technological innovation is constantly required, and high precision in precision stamped products is essential. Therefore, how to improve quality and enhance value is an important theme. Additionally, for precision stamped products aimed at the semiconductor sector, factors beyond "precision," such as insertability, adhesion, and bonding strength, must also be improved. We provide proposals to achieve optimal quality by considering the application and usage environment. [Examples] - Modification of the die shape to prevent scrap lifting - Improvement of insertability for substrate-inserted terminals - Enhancement of bonding strength in solder joints - Maximization of flat surfaces by reducing the draw surface in stamping *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
**Example: Improvement of Adhesive Strength in Solder Joining** ■Before In semiconductor assembly, chips are mounted at designated locations on the lead frame and are joined with solder. Depending on the surface condition of the lead frame, the adhesive strength with the solder may not be sufficient, leading to issues such as delamination. When delamination occurs, it can adversely affect the semiconductor device or product. ■After By performing mesh processing on the chip mounting surface of the lead frame, it is possible to increase the contact area with the solder, which is the joining material, thereby improving adhesive strength. Additionally, the grooves arranged in a lattice pattern help prevent solder flow to unnecessary areas. ■Point When a metal plate is fixed to other components using joining materials such as solder, applying mesh processing to the joining surface of the metal plate can increase the surface area in contact with the joining material, thereby enhancing its adhesive strength. Depending on the depth of the mesh applied, it is recommended to use a relatively thick material with a plate thickness of 0.6mm or more, considering potential damage to the back side of the metal plate. *For more details, please refer to the PDF document or feel free to contact us.*
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Since our establishment in 1985, our company has consistently engaged in the development, design, and manufacturing of lead frames and mold dies for semiconductors, as well as precision molds. Leveraging the know-how cultivated through years of experience, we provide better products to a wide range of customers. Additionally, we have many qualified personnel and utilize state-of-the-art equipment along with accumulated technical expertise, focusing on high-precision mold processing as our core technology. We aim to actively respond to our customers' needs as a partner in the development, design, and manufacturing of various products. As globalization progresses and overseas competitors continue to grow rapidly, we strive to demonstrate our manufacturing superiority, meet expectations regarding quality, cost, and delivery, and aim to be a company that is needed by our customers, while maintaining a commitment to manufacturing in Japan and continuing our daily efforts.
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