Introducing custom precision lead frames for small signal transistors and optical semiconductors!
Here is an introduction to a case study on the production of lead frames used in discrete (individual) semiconductor small signal packages. The materials for the lead frames are mainly Cu alloys and 42 Alloy, with thicknesses ranging from 0.08 to 0.2 mm. The punching parts achieve a processing accuracy of ±0.02 mm, resulting in high-quality lead frames. 【Case Study】 ■ Product: Lead frame for small signal transistors ■ Industry: Semiconductor ■ Processing Classification: Press, punching, bending ■ Accuracy: ±0.02 mm (punching parts) ■ Material: Cu alloy, 42 Alloy *For more details, please refer to the PDF document or feel free to contact us.
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【Other Examples】 <Lead Frame for Power Transistors> ■Industry: Semiconductor ■Processing Classification: Press, Punching, Bending ■Accuracy: ±0.03mm (Punching Part) ■Material: Cu Alloy <Lead Frame for Optoelectronics> ■Industry: Semiconductor ■Processing Classification: Press, Punching, Bending ■Accuracy: ±0.03mm (Punching Part) ■Material: Cu Alloy, 42 Alloy, Steel (SPC) <MAP Type Lead Frame for Semiconductors> ■Industry: Semiconductor ■Processing Classification: Press, Punching, Bending ■Accuracy: ±0.02mm (Punching Part) ■Material: Cu Alloy *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Since our establishment in 1985, our company has consistently engaged in the development, design, and manufacturing of lead frames and mold dies for semiconductors, as well as precision molds. Leveraging the know-how cultivated through years of experience, we provide better products to a wide range of customers. Additionally, we have many qualified personnel and utilize state-of-the-art equipment along with accumulated technical expertise, focusing on high-precision mold processing as our core technology. We aim to actively respond to our customers' needs as a partner in the development, design, and manufacturing of various products. As globalization progresses and overseas competitors continue to grow rapidly, we strive to demonstrate our manufacturing superiority, meet expectations regarding quality, cost, and delivery, and aim to be a company that is needed by our customers, while maintaining a commitment to manufacturing in Japan and continuing our daily efforts.
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