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  6. [Product Example] Precision Molds

[Product Example] Precision Molds

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last updated:Aug 04, 2017

姫路東芝電子部品
姫路東芝電子部品
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Examples of high-precision and high-quality precision and fine press-processed products.

We will introduce a case study of precision machined parts used in precision press processing punch molds. The outer dimensions are elongated at 15mm × 120mm × 450mm, and a square hole for incorporating core components has been machined. Due to the elongated shape of this mold part, it is common for elongation to occur during the square hole machining process, which tends to worsen dimensional accuracy. However, by numerically setting the amount of elongation for the square hole, we have achieved high-precision machining that keeps the square hole size and pitch within ±0.005mm. 【Case Study】 ■ Product: Punch mold parts for precision press processing ■ Industry: Semiconductor ■ Machining Classification: Wire Electrical Discharge Machining ■ Machining Accuracy: ±0.005mm ■ Material: SKD ■ Dimensions: 15mm × 120mm × 450mm *For more details, please refer to the PDF document or feel free to contact us.

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[Product Example] Precision Molds

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【Other Examples】 <Discharge Machining Electrode> ■Industry: Semiconductor ■Processing Classification: Machining ■Processing Accuracy: ±0.005mm ■Material: Cu, Cu Tungsten, Graphite ■Dimensions: 50mm×80mm×60mm <Aluminum Bending and Cutting Die> ■Industry: Semiconductor ■Processing Classification: Assembly ■Processing Accuracy: ±0.002mm ■Material: SKD/Others ■Dimensions: 90mm×120mm×110mm <Precision Press Processing Punch Die Parts> ■Industry: Semiconductor ■Processing Classification: Grinding (Profile Grinding, Surface Grinding) ■Processing Accuracy: ±0.001mm ■Material: Ceramic ■Dimensions: 10mm×15mm×70mm *For more details, please refer to the PDF document or feel free to contact us.

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[Product Example] Precision Molds

[Product Example] Precision Molds

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姫路東芝電子部品

姫路東芝電子部品

Electronic Components and Semiconductors

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Since our establishment in 1985, our company has consistently engaged in the development, design, and manufacturing of lead frames and mold dies for semiconductors, as well as precision molds. Leveraging the know-how cultivated through years of experience, we provide better products to a wide range of customers. Additionally, we have many qualified personnel and utilize state-of-the-art equipment along with accumulated technical expertise, focusing on high-precision mold processing as our core technology. We aim to actively respond to our customers' needs as a partner in the development, design, and manufacturing of various products. As globalization progresses and overseas competitors continue to grow rapidly, we strive to demonstrate our manufacturing superiority, meet expectations regarding quality, cost, and delivery, and aim to be a company that is needed by our customers, while maintaining a commitment to manufacturing in Japan and continuing our daily efforts.

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