Introduction to narrow frame molding and thin-walled molding! Electronic component insert technology.
The "Electronic Component Insert Technology" is a technique for inserting electronic components into various coating materials and molding them into a single unit. It seals non-rigid films and similar materials with rubber, and protects rigid substrates with rubber materials. Narrow frame molding and thin-walled molding are possible. 【Features】 ■ Inserts electronic components into various coating materials for integrated molding ■ Seals non-rigid films and similar materials with rubber ■ Protects rigid substrates with rubber materials ■ Capable of narrow frame molding and thin-walled molding *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Features of Silicone Sealing】 ■ Silicone materials have high environmental reliability ■ Biocompatible ■ Can be molded into shapes due to the use of molds ■ Can be combined with silicone decoration *For more details, please refer to the PDF document or feel free to contact us.
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【Application】 ■ Narrow frame molding / Thin-walled molding *For more details, please refer to the PDF document or feel free to contact us.
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San Arrow specializes in molding, processing, and adhesive technology for composite materials centered around resin and rubber in various fields such as automotive, electronics, and medical. We have equipment that allows for integrated production from mold making to assembly, enabling us to handle processes that were previously outsourced to multiple vendors in a one-stop manner.