It is a bonding device that adheres wafers and substrates such as sapphire, SiC, and GaN to support substrates (adhesive plates) made of ceramics or glass using wax.
The "MHD240-SS" is a bonding device that adheres thin substrates such as sapphire, SiC, and GaN wafers to support substrates made of materials like ceramic and glass using wax adhesion. By applying uniform pressure to the samples through air pressure, it allows for even and consistent bonding to the support substrate. The device can set the wax curing time (cooling time), which helps prevent shrinkage of the wax due to rapid cooling. 【Features】 ■ A device for attaching thin substrates to support substrates using wax ■ Capable of vacuum release during bonding ■ Uniform pressure application to samples through air pressure for consistent bonding ■ Bonding settings are controlled by a sequencer program ■ Allows for setting the wax curing time to prevent rapid cooling *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Specifications】 ■Wafer size: 3 to 6 inches ■Support plate: φ190mm ■Setting temperature range: Room temperature to 140℃ ■Pressure setting range: 0.05 to 0.3MPa ■Utility: Input power AC200V 1PH 50/60Hz ■Power consumption: 35A ■Dimensions: W830×D800×H1582mm ■Weight: Approximately 280kg *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Kitagawa Gresstech Co., Ltd. was established through the merger of System Seiko Co., Ltd. and Kemet Japan Co., Ltd. By combining the technology cultivated by System Seiko in HDD polishing equipment with the know-how developed by Kemet Japan in polishing consumables and contract processing for semiconductors and electronic components, we aim to strengthen our sales and development capabilities and further expand our business.
