Wafer Bonding Device, Stationary Type 'MHD240-SS'

It is a bonding device that adheres wafers and substrates such as sapphire, SiC, and GaN to support substrates (adhesive plates) made of ceramics or glass using wax.

The "MHD240-SS" is a bonding device that adheres thin substrates such as sapphire, SiC, and GaN wafers to support substrates made of materials like ceramic and glass using wax adhesion. By applying uniform pressure to the samples through air pressure, it allows for even and consistent bonding to the support substrate. The device can set the wax curing time (cooling time), which helps prevent shrinkage of the wax due to rapid cooling. 【Features】 ■ A device for attaching thin substrates to support substrates using wax ■ Capable of vacuum release during bonding ■ Uniform pressure application to samples through air pressure for consistent bonding ■ Bonding settings are controlled by a sequencer program ■ Allows for setting the wax curing time to prevent rapid cooling *For more details, please refer to the PDF materials or feel free to contact us.

Processing Jig