We also accept contract lap polishing processing for difficult-to-machine materials!
At Kemet Japan's Technical Center (Chiba Tohkyo Factory), we offer contract lap processing, lap polishing development, and test lap processing services. We can handle work sizes from a few mm to 300 mm, with flatness requirements of <1μm and surface roughness requirements of <1nm, using our in-house lap and polish machines to meet your needs. *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Technical Center Equipment】 ■Surface Grinding Machine (Maximum Processing Size: 600×400) ■Double-Sided Lapping/Polishing Machine ■Single-Sided Lapping Machine (Lapping Plate: Coarse Grinding, Diamond Lapping) ■Lapping Machine with Facing ■Single-Sided Polishing Machine ■Ultrasonic Cleaning Machine ■Tabletop Cleaning Machine ■IPA Vapor Dryer ■Semi-Automatic Diaphragm Wax Application Machine ■Metal Microscope ■SEM Imaging Microscope ■Differential Interference Microscope ■Surface Roughness Tester ■ZYGO NEWVIEW7300 ■Interferometric Fringe Type Flatness Measurement Device ■Toropel FLAT MASTER200 ■Thickness Measurement Device ■Particle Size Distribution Measurement Device (Microtrack) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
Company information
Kitagawa Gresstech Co., Ltd. was established through the merger of System Seiko Co., Ltd. and Kemet Japan Co., Ltd. By combining the technology cultivated by System Seiko in HDD polishing equipment with the know-how developed by Kemet Japan in polishing consumables and contract processing for semiconductors and electronic components, we aim to strengthen our sales and development capabilities and further expand our business.