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  1. Home
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  4. Contract Services
  5. Processing Contract
  6. Contract Processing: Examples of Hole Drilling with Laser

Contract Processing: Examples of Hole Drilling with Laser

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last updated:Jul 09, 2019

東成イービー東北
東成イービー東北
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Introducing fine and precise hole drilling processing using lasers.

The new ultra-short pulse laser processing machine enables processing with minimal thermal impact. We would like to introduce some cutting processing examples as samples from our application cases. We will respond to customer requests regarding processing methods and more. 【Drilling Processing Examples (Sample)】 ■ Drilling of Polyimide Material - Equipment Used: TEA-CO2 Laser - Material: Polyimide - Hole Diameter: φ0.2 / Plate Thickness: 0.125m / Magnification: ×350 ■ Cross-section of Polyimide Drilling Processing - Equipment Used: TEA-CO2 Laser - Material: Polyimide - Hole Diameter: φ0.2 / Plate Thickness: 0.125mm / Magnification: ×350, etc. *For more details, please refer to the PDF document or feel free to contact us. Alternatively, visit our website at https://www.ebtohoku.co.jp/

    Processing Contract
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Contract Processing: Examples of Hole Drilling with Laser

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【Other Cutting Processing Examples (Samples)】 ■ Acrylic Material Drilling - Equipment Used: TEA-CO2 Laser - Material: Acrylic - Hole Diameter: φ0.2 / Plate Thickness: 2.0mm / Magnification: ×200 ■ Silicone Rubber Drilling - Equipment Used: TEA-CO2 Laser - Material: Silicone Rubber - Hole Diameter: φ0.2 / Plate Thickness: 0.300mm / Magnification: ×350 ■ Teflon Drilling - Equipment Used: TEA-CO2 Laser - Material: Teflon - Hole Diameter: φ0.2mm / Plate Thickness: 0.100mm / Magnification: ×350 ■ Quartz Glass Drilling - Equipment Used: TEA-CO2 Laser - Material: Quartz Glass - Hole Diameter: φ0.4 / Plate Thickness: 0.500mm / Magnification: ×200 ■ PET Drilling - Equipment Used: TEA-CO2 Laser - Material: PET - Hole Diameter: φ0.2 / Plate Thickness: 0.300mm / Magnification: ×350, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Higashi Nari E.B. Tohoku Co., Ltd. Company Profile

Higashi Nari E.B. Tohoku Co., Ltd. Company Profile

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Ultrafine processing with cutting-edge laser technology.

Ultrafine processing with cutting-edge laser technology.

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Introduced in 2020! Precision machining with cutting-edge laser equipment!

Introduced in 2020! Precision machining with cutting-edge laser equipment!

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東成イービー東北

東成イービー東北

Manufacturing and processing contract

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Higashinaru E.B. Tohoku Co., Ltd. is committed to pursuing originality in technology. *We have been selected as a regional future-leading company! We provide welding quality utilizing our extensive equipment and high technical skills gained from years of experience, including "electron beam contract processing" and "laser contract processing," which responds to high-quality and high-precision demands through new processing technologies such as precision welding and ultra-fine drilling. Additionally, please make use of our engineering business, which supports customers with all our strength as a "comprehensive manufacturing company" centered on high-density energy beam technology.

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